3S-Wick® patented vacuumization technology is preferred by leading organizations worldwide. Vacuumization yields a high-speed response wick for quickest and safest de-soldering. A simultaneaous comparison dip-test (MIL-STD-202 E Method 208 C) with competitive wicks will show the differences.
3S-Wick® flux is based on mildest non-corrosive, non-hygroscopic, non-conductive rosins of 'no-clean' quality.
3S-Wick® conforms to the most stringent soldering standards set worldwide i.e. DIN-8516, DIN-8527, DIN-8511-F-SW32 (German), BS-441, DTD-599A (British), JIS-C-2519, JIS-C-2512 (Japanese), ASTM-B284, NASA Publications MIL-F-14256D type W and A, NPC-200-4 Quality Publication, NASA-SP5002 Soldering Electrical Connections, NASA-NHB-5300 Reliability and Quality Assurance Publications, and others.
3S-Wick® is used and has been used for the most demanding desoldering operations in spacecraft and military electronics. 'No-clean' residues can be left safely on the desoldered area.
IMPORTANT
The minimal residues left on the soldered area do also act as a solderability conservation for that area, should the resoldering not be done immediately there.
The technical term 'no-clean' Wick found in desolder braid descriptions and specs usually refers to a wick whose desoldering operation only leaves a minor amount of flux on the desoldered area and which do use a flux composition whose residues can be left safely on the desoldered area.
A fluxless wick as often proposed does not exist and can not function by metallurgical reasons.
