RESIN FR476 1KG

Medium viscosity epoxy casting resin system for encapsulation of electrical and electronic equipment. Tek113B provides good gloss finish and medium reactivity. Standard hardener for electronic potting.

• Colour: Brown
• Mixing Ratio
• ER130 : 100 pbw
• TEK113B : 16 pbw
• Density
• ER130: 1.60
• Tek113B: 0.95
• Viscosity
• ER130 : 30000 to 60000 mPa.s at 25°C
• TEK113B : 300 to 500 mPa.s at 25°C
• Pot Life: 30 to 40 minutes at 25°C
• Gelation Time: 2 to 2 1/2 Hours at 25°C (Test tube Gelnorm DIN 16945)
• Curing Time : 4 to 5 hours at 25°C (500 Grams)

Characteristics After Cure

• Hardness : 75 Shore D after 3 days at 25°C
• Dielectric Strength : 1.3 KV/mm (Approx.)
• Heat Distortion Temperature : 60°C
• Continuous Temp. of Operation : 70°C (25000 h weight loss)