Potting Compound Rigid 1KG- Resin/160G Hardner-Mixing Ratio By Volume 100 CCS X 35CCS Brown
1KG Potting Compound Rigid
Overview
Medium viscosity epoxy casting resin system for encapsulation of electrical and electronic equipment. Tek113B provides good gloss finish and medium reactivity. Standard hardener for electronic potting.
Features
Resin Fr476
Specifications
Colour: Brown
Mixing Ratio
ER130 : 100 pbw
TEK113B : 16 pbw
Density
ER130: 1.60
Tek113B: 0.95
Viscosity
ER130 : 30000 to 60000 mPa.s at 25°C
TEK113B : 300 to 500 mPa.s at 25°C
Pot Life: 30 to 40 minutes at 25°C
Gelation Time: 2 to 2 1/2 Hours at 25°C (Test tube Gelnorm DIN 16945)
Curing Time : 4 to 5 hours at 25°C (500 Grams)
Characteristics After Cure
Hardness : 75 Shore D after 3 days at 25°C
Dielectric Strength : 1.3 KV/mm (Approx.)
Heat Distortion Temperature : 60°C
Continuous Temp. of Operation : 70°C (25000 h weight loss)
Discover the RESIN FR476 1KG, a high-performance epoxy casting resin perfect for encapsulating electrical and electronic components. With a glossy finish and excellent reactivity, this medium viscosity potting compound ensures durability and protection against environmental factors. Trust in RESIN FR476 for reliable performance and long-lasting results in your projects.